Surface Mount Assembly or the technology is a method to construct electronic circuit in which the materials are organized directly onto the surfacing area of printed circuit boards. Any electronic device which is made in this way is termed a surface mount device. In the manufacturing organization it has highly replaced the “hole” technology producing technique of setting components wire pioneers into holes in those circuit boards. Both methods can be handled on the similar board for materials not matched to surface organizing like semiconductors of power and the transformers. As the SMT component and Contract Electronic Manufacturing Services are generally smaller than its own through-hole complementary part, it has either little leads or nothing at all. SMT component may have some leads of styles or short pins, BGAs, flat contacts or conclusion on the figure of the component.
